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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the…
Disadvantages, Description & Variants
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bga package balls solder grid used pcb array ball packages chip devices also bgas pins circuit device thermal integrated soldering
| Subject | Predicate | Object | Confidence | Src |
|---|---|---|---|---|
| microprocessors | instance of | BGA packages are used to permanently mount devices | 0.80 | text |
| in computer-controlled automatic reflow ovens | instance of | Soldering of BGA devices requires precise control and is usually done by automated processes | 0.80 | text |
| high temperature | instance of | problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions | 0.80 | text |
| high thermal shock | instance of | problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions | 0.80 | text |
| high gravitational force environments | instance of | problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions | 0.80 | text |
| in part due to lower ductility of RoHS-compliant solders.Mechanical stress issues can be overcome by bonding the devices to the board through a process called | instance of | problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions | 0.80 | text |
| heat guns | instance of | various DIY reflow methods have been developed using inexpensive heat sources | 0.80 | text |
| and domestic toaster ovens | instance of | various DIY reflow methods have been developed using inexpensive heat sources | 0.80 | text |
| electric skillets | instance of | various DIY reflow methods have been developed using inexpensive heat sources | 0.80 | text |
| Ball grid array | related to Variants | CABGA | 0.60 | section |
| Ball grid array | related to Variants | PBGA | 0.60 | section |
| Ball grid array | related to Variants | CTBGA | 0.60 | section |
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