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Dual in-line package

In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at…

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Overview

Applications

Construction

Orientation and lead numbering

Descendants

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Map overview Semantic statistics

Dual in-line package

Nodes63
Edges62
Triples16
Avg. degree1.97
Density0.031746
Components1

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Dual in-line package

Top relations

related to Variants · 15
Dual in-line package → An, CDIP, Ceramic, CERDIP, DIP, ICs, Modern, PDIP, Plastic, SDIP, Several DIP, Shrink, Skinny, Sometimes, SPDIP

Important terminology Word statistics

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Important terminology

dip package packages leads used devices pins lead dips plastic die two types usually device in-line pin chip integrated ic

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
plastic leaded chip carrierinstance ofpackages0.80text
Dual in-line packagerelated to VariantsSeveral DIP0.60section
Dual in-line packagerelated to VariantsICs0.60section
Dual in-line packagerelated to VariantsCeramic0.60section
Dual in-line packagerelated to VariantsCERDIP0.60section
Dual in-line packagerelated to VariantsCDIP0.60section
Dual in-line packagerelated to VariantsPlastic0.60section
Dual in-line packagerelated to VariantsPDIP0.60section
Dual in-line packagerelated to VariantsModern0.60section
Dual in-line packagerelated to VariantsShrink0.60section
Dual in-line packagerelated to VariantsSPDIP0.60section
Dual in-line packagerelated to VariantsSkinny0.60section

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    Min side: 3
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