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Quad flat package

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP)…

Variants, Limitations & Overview

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Variants

PIC microcontroller Thermal pad Cyrix Cx486SLC ST6 microcontroller HVQFN

6 related topics

Limitations

Small outline packages Solder bridges Pin grid array Ball grid array

4 related topics

Overview

Surface-mounted Integrated circuit Package Pitch Electronic calculators

13 related topics

Topics to explore

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Overview

Surface-mounted Surface-mount technology
Integrated circuit
Package Integrated circuit packaging
Pitch Pin pitch
Electronic calculators Electronic calculator
Consumer electronics Consumer electronic
Europe
United States
Hole mounted Through-hole
Socketed DIP socket
Printed circuit board
Plastic leaded chip carrier
NOR flash memories NOR flash memory

Limitations

Small outline packages Small outline package
Solder bridges Solder bridge
Pin grid array
Ball grid array

Variants

PIC microcontroller
Thermal pad Thermally conductive pad
Cyrix Cx486SLC
ST6 microcontroller ST6 and ST7
HVQFN Quad Flat No-leads package
Surface mount

Advanced semantic analysis

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Map overview Semantic statistics

Quad flat package

Nodes27

Edges26

Triples15

Avg. degree1.93

Density0.074074

Components1

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Quad flat package

Top relations

related to Variants · 11

Quad flat package → BQFP, CQFP, Cyrix Cx486SLC80-pin, LQFP, PIC, QFP, ST6, The, These, TP, TQFP

Important terminology Word statistics

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Important terminology

package qfp packages pins mm quad leads flat used cqfp ceramic pitch spacing lead soldered top thin tqfp number circuit

Entity relationships Subject–Predicate–Object triples

Subject	Predicate	Object	Confidence	Src
increasing board density	instance of	1.4 mm thick and a lead pitch of 0.4 mm.TQFPs help solve issues	0.80	text
die shrink programs	instance of	1.4 mm thick and a lead pitch of 0.4 mm.TQFPs help solve issues	0.80	text
thin end-product profile	instance of	1.4 mm thick and a lead pitch of 0.4 mm.TQFPs help solve issues	0.80	text
portability	instance of	1.4 mm thick and a lead pitch of 0.4 mm.TQFPs help solve issues	0.80	text
Quad flat package	related to Variants	LQFP	0.60	section
Quad flat package	related to Variants	TQFP	0.60	section
Quad flat package	related to Variants	PIC	0.60	section
Quad flat package	related to Variants	QFP	0.60	section
Quad flat package	related to Variants	TP	0.60	section
Quad flat package	related to Variants	BQFP	0.60	section
Quad flat package	related to Variants	Cyrix Cx486SLC80-pin	0.60	section
Quad flat package	related to Variants	CQFP	0.60	section

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Min side: 3

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