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Flip chip

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by…

History, Comparison of mounting technologies & Process steps

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Overview

Process steps

Comparison of mounting technologies

History

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Map overview Semantic statistics

Flip chip

Nodes37
Edges36
Triples21
Avg. degree1.95
Density0.054054
Components1

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Flip chip

Top relations

related to Flip chip · 6
Flip chip → IC, Near, Processing, The, This, To
related to Tape-automated bonding · 5
Flip chip → Also, Originally TAB, R2R, TAB, Tape-automated
related to Disadvantages · 4
Flip chip → Flip, The, They, This

Important terminology Word statistics

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Important terminology

solder chip pads chips wafer process deposited circuitry also external flip using flip-chip board onto mounting bonding substrate top typically

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
semiconductor devicesinstance ofis a method for interconnecting dies0.80text
IC chipsinstance ofis a method for interconnecting dies0.80text
integrated passive devicesinstance ofis a method for interconnecting dies0.80text
microelectromechanical systemsinstance ofis a method for interconnecting dies0.80text
thermosonic bondinginstance oftypically via wire bonding0.80text
Ajinomoto Build up Filminstance ofSubstates made with build up film0.80text
Flip chiprelated to DisadvantagesFlip0.60section
Flip chiprelated to DisadvantagesThe0.60section
Flip chiprelated to DisadvantagesThey0.60section
Flip chiprelated to DisadvantagesThis0.60section
Flip chiprelated to Flip chipProcessing0.60section
Flip chiprelated to Flip chipIC0.60section

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