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Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the…

Disadvantages, Description & Variants

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Ball grid array

Nodes60
Edges59
Triples37
Avg. degree1.97
Density0.033333
Components1

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Ball grid array

Top relations

related to Variants · 16
Ball grid array → Altera, BGA, BGATBGA, BGATEPBGA, CABGA, CTBGA, Effectively, FCmBGA, It, JEDEC-Standard, Not, PBGA, SBGA, This, UBGA, VFBGA
see also · 12
Ball grid array → Chip, COB, DIP, Dual, Land, LGA, PGA, Pin, Small-outline, SOIC, Thin, TQFP

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Important terminology

bga package balls solder grid used pcb array ball packages chip devices also bgas pins circuit device thermal integrated soldering

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
microprocessorsinstance ofBGA packages are used to permanently mount devices0.80text
in computer-controlled automatic reflow ovensinstance ofSoldering of BGA devices requires precise control and is usually done by automated processes0.80text
high temperatureinstance ofproblems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions0.80text
high thermal shockinstance ofproblems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions0.80text
high gravitational force environmentsinstance ofproblems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions0.80text
in part due to lower ductility of RoHS-compliant solders.Mechanical stress issues can be overcome by bonding the devices to the board through a process calledinstance ofproblems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions0.80text
heat gunsinstance ofvarious DIY reflow methods have been developed using inexpensive heat sources0.80text
and domestic toaster ovensinstance ofvarious DIY reflow methods have been developed using inexpensive heat sources0.80text
electric skilletsinstance ofvarious DIY reflow methods have been developed using inexpensive heat sources0.80text
Ball grid arrayrelated to VariantsCABGA0.60section
Ball grid arrayrelated to VariantsPBGA0.60section
Ball grid arrayrelated to VariantsCTBGA0.60section

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