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Electroplating

Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part that needs to be coated acts as the cathode (negative electrode) of an electrolytic cell; the electrolyte is a solution…

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Electroplating

Nodes138
Edges137
Triples100
Avg. degree1.99
Density0.014493
Components1

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Electroplating

Top relations

related to history · 14
Electroplating → Alessandro Volta's, Baghdad Battery, Britain, Brugnatelli, Brugnatelli's, By, Europe, French Academy, Italian, Luigi Valentino Brugnatelli, Parthian Empire, Research, Russia, Sciences
related to Alternatives · 13
Electroplating → Another, Chemical, Disadvantages, Electroless, ENIG, Gilding, Immersion, Nevertheless, Physical, Sputtering, The, There, This
related to Cleanliness · 9
Electroplating → ASTM B322, ASTM F22, Cleaning, Cleanliness, Hydrophobic, Perfectly, Surfactants, The, This
related to Process · 9
Electroplating → At, Cu2, For, II, In, SO2, The, These, When
related to Pulse electroplating · 8
Electroplating → Another, By, Duty, However, Peak, PED, Pulse, The
related to Throwing power · 7
Electroplating → FL, It, Micro, RT, Throwing, Wa, Wagner
has effect · 6
Electroplating → Chemically, Copper-plated, For, Mechanically, Physically, Tin-plated
related to Hull cell · 6
Electroplating → As, Hull, It, The, The Hull, This
related to Brush electroplating · 5
Electroplating → Brush, Disadvantages, It, The, With
related to Barrel plating · 3
Electroplating → It, The, This

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Important terminology

current metal plating used anode power solution process bath throwing cell plated thickness cathode copper surface metals substrate processes test

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
copper.The aforementioned electroplating of metals uses an electroreduction processinstance ofIt is also used to purify metals0.80text
carbonatesinstance ofnon-metal chemicals0.80text
phosphates may be added to increase conductivity.When plating is not desired on certain areas of the substrateinstance ofnon-metal chemicals0.80text
stop-offs are applied to prevent the bath from coming in contact with the substrateinstance ofnon-metal chemicals0.80text
platinum.Other factors that affect the pulse electroplating include temperatureinstance ofinert electrode0.80text
anode-to-cathode gapinstance ofinert electrode0.80text
and stirringinstance ofinert electrode0.80text
oils cause the water to beadinstance ofHydrophobic contaminants0.80text
break upinstance ofHydrophobic contaminants0.80text
allowing the water to drain rapidlyinstance ofHydrophobic contaminants0.80text
soap reduce the sensitivity of the testinstance ofSurfactants0.80text
must be thoroughly rinsed offinstance ofSurfactants0.80text

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