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Dry etching

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material…

History & Applications

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Overview

Applications

High aspect ratio structures

Hardware design

History

Advanced semantic analysis

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Map overview Semantic statistics

Dry etching

Nodes36
Edges35
Triples34
Avg. degree1.94
Density0.055556
Components1

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Dry etching

Top relations

related to history · 12
Dry etching → Dennard, Dry, Hwa-Nien Yu, IBM, Irving, It, MOSFETs, Robert, Stephen, The, Watson Research Center, Yu
related to Hardware design · 8
Dry etching → Applied Materials, Design, For, Lam, RF, The, Tokyo Electronic, While
has application · 5
Dry etching → Along, Applications, Dry, FinFET, The
related to High aspect ratio structures · 1
Dry etching → Dry

Important terminology Word statistics

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Important terminology

dry etching semiconductor plasma etch process used high equipment removal material wet typically design see oxygen may uniformity sometimes portions

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
fluorocarbonsinstance ofusually a plasma of reactive gases0.80text
oxygeninstance ofusually a plasma of reactive gases0.80text
chlorineinstance ofusually a plasma of reactive gases0.80text
boron trichlorideinstance ofusually a plasma of reactive gases0.80text
pitch doubling or quartering to gain advanced resolutionsinstance ofso many manufacturers rely on dry etching strategies0.80text
Tokyo Electronicinstance ofand an exhaust system.Design varies from manufacturers0.80text
Applied Materialsinstance ofand an exhaust system.Design varies from manufacturers0.80text
and Laminstance ofand an exhaust system.Design varies from manufacturers0.80text
Dry etchinghas applicationDry0.60section
Dry etchinghas applicationApplications0.60section
Dry etchinghas applicationFinFET0.60section
Dry etchinghas applicationAlong0.60section

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    Min side: 3
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