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Semiconductor package

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment…

Standards, Package materials & Special packages

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Overview

Package functions

Leads

Sockets

Package materials

Hybrid integrated circuits

Special packages

Standards

Advanced semantic analysis

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Map overview Semantic statistics

Semiconductor package

Nodes64
Edges63
Triples34
Avg. degree1.97
Density0.03125
Components1

How this topic connects Entity context

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Semiconductor package

Top relations

related to Special packages · 7
Semiconductor package → An, Light-emitting, Packages, Pressure-sensing, Semiconductor, Special, Very-high-impedance
related to Standards · 7
Semiconductor package → Assorted, EIAJ, JEDEC, Just, Pro Electron, This, VLSI
related to Package functions · 4
Semiconductor package → In, Larger, Stray, Very
is a · 1
Semiconductor package → metal

Important terminology Word statistics

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Important terminology

package devices packages leads semiconductor used circuit integrated may metal device circuits plastic glass heat ceramic date code sockets soldered

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
Semiconductor packageis ametal0.90text
landsinstance ofvia leads0.80text
ballsinstance ofvia leads0.80text
or pinsinstance ofvia leads0.80text
diodesinstance ofPackage functionsA semiconductor package may have as few as two leads or contacts for devices0.80text
or in the case of advanced microprocessorsinstance ofPackage functionsA semiconductor package may have as few as two leads or contacts for devices0.80text
a package may have several thousand connectionsinstance ofPackage functionsA semiconductor package may have as few as two leads or contacts for devices0.80text
microprocessors where replacement is still more economical than discarding the productinstance offor high-value chips0.80text
and for applications where the chip contains firmware or unique data that might be replaced or refreshed during the life of the productinstance offor high-value chips0.80text
transistors may be disturbed by stray lightinstance ofother devices0.80text
require an opaque packageinstance ofother devices0.80text
JEDECinstance ofsemiconductor packages standards may be defined by national or international industry associations0.80text

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    Min side: 3
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