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Plasma-enhanced chemical vapor deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) alternating…

Applications, Film examples and applications & Reactor types

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Sputter depositionSilicon dioxideDichlorosilaneSilaneOxygen
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Reactor types

Hz13.56 MHzVoltsLow-energy plasma-enhanced chemical vapor deposition
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Discharges for processes

TorrSputtering
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Overview

Chemical vapor depositionGasVaporSolidSubstrate
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Plasma-enhanced chemical vapor deposition

Nodes36
Edges35
Triples1
Avg. degree1.94
Density0.055556
Components1

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Plasma-enhanced chemical vapor deposition

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see also · 1
Plasma-enhanced chemical vapor deposition → Low-energy

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deposition plasma discharge silicon used plasmas high films discharges film also electrons ion bombardment deposited chemical reactor dioxide torr molecules

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SubjectPredicateObjectConfidenceSrc
Plasma-enhanced chemical vapor depositionsee alsoLow-energy0.60section

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