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Decapping

Decapping (decapsulation) or delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die. This process is typically done in order to debug a manufacturing problem…

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Decapping

Nodes17
Edges16
Triples16
Avg. degree1.88
Density0.117647
Components1

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Decapping

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related to Method · 3
Decapping → Chemical, IC, The

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Important terminology

die delidding ihs chip integrated ic circuit process reverse also package heat plastic processor done device chips engineer decap etching

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
TechInsightsinstance ofCompanies0.80text
ChipRebel decapinstance ofCompanies0.80text
take die shots ofinstance ofCompanies0.80text
and reverse engineer chips for customersinstance ofCompanies0.80text
a processorinstance ofor epoxy packages.Delidding may also be done to test the chip for radiation-tolerance with a heavy-ion beam or in an effort to reduce the operating temperatures of an integrated…0.80text
by replacing the thermal interface materialinstance ofor epoxy packages.Delidding may also be done to test the chip for radiation-tolerance with a heavy-ion beam or in an effort to reduce the operating temperatures of an integrated…0.80text
appropriate glovesinstance ofso protective equipment0.80text
full face respirator with appropriate acid cartridgesinstance ofso protective equipment0.80text
a lab coatinstance ofso protective equipment0.80text
a fume hood are required.Laser decapping scans a high power laser beam across the plastic IC package to vaporize itinstance ofso protective equipment0.80text
while avoiding the actual silicon die.In a common version of non-destructiveinstance ofso protective equipment0.80text
mechanical deliddinginstance ofso protective equipment0.80text

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