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Thermal interface material

A thermal interface material (TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

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Thermal interface material

Nodes21
Edges20
Triples4
Avg. degree1.9
Density0.095238
Components1

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thermal heat tims paste material sink resistance used pcm tim device materials well pastes bond curing pads interface inserted also

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SubjectPredicateObjectConfidenceSrc
low thermal stress between materials of different thermal expansion coefficientsinstance ofwhile addressing application requirements0.80text
low elastic modulus or viscosityinstance ofwhile addressing application requirements0.80text
as well as ensuring flexibilityinstance ofwhile addressing application requirements0.80text
reusability.Thermal pasteinstance ofwhile addressing application requirements0.80text

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