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Sputter deposition

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer.

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Applications, Uses & Types of sputter deposition

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Overview

Uses

Comparison with other deposition methods

Types of sputter deposition

Structure and morphology

Advanced semantic analysis

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Map overview Semantic statistics

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Sputter deposition

Nodes79
Edges78
Triples74
Avg. degree1.97
Density0.025316
Components1

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Sputter deposition

Top relations

related to Structure and morphology · 15
Sputter deposition → DC, Demchishin, Denoting, In, It, Ja, Ji, Ji/Ja, Movchan, Next, Since, Td, The, Thornton, Ti
has method · 13
Sputter deposition → Advanced, Also, An, Knudsen, Pulsed, Role, Some, Sputter, Sputtered, Sputtering, The, This, Thus
related to Further reading · 12
Sputter deposition → AVS Education Committee Book, Handbook, ISBN, Kiyotaka Wasa, MattoxWilliam, Noyes Publications, Series, Shigeru Hayakawa, The Foundations, Vacuum Coating Technology, Vol, Westwood
related to Uses · 10
Sputter deposition → Another, Because, CDs, CrOx, DVDs, Hard, One, Sputtering, The, Thin
related to Sputter coating · 6
Sputter deposition → Au/Pd, For, SEM, Sputter, While, X-ray
is a · 1
Sputter deposition → physical vapor deposition
related to High-power impulse magnetron sputtering (HiPIMS) · 1
Sputter deposition → HiPIMS

Important terminology Word statistics

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Important terminology

sputtering deposition sputter gas target film used process substrate also sputtered ions reactive source atoms pressure coating thin material chamber

Entity relationships Subject–Predicate–Object triples

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SubjectPredicateObjectConfidenceSrc
Sputter depositionis aphysical vapor deposition0.90text
argoninstance ofThe entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure.The sputtering gas is often an inert gas0.80text
zinc oxideinstance ofThe coating is a multilayer containing silver and metal oxides0.80text
tin oxideinstance ofThe coating is a multilayer containing silver and metal oxides0.80text
or titanium dioxideinstance ofThe coating is a multilayer containing silver and metal oxides0.80text
sputtering depositioninstance ofusing CMOS-compatible fabrication techniques0.80text
subtractive etch.Sputter coatingSputter coating in scanning electron microscopy is a sputter deposition processinstance ofusing CMOS-compatible fabrication techniques0.80text
oxygeninstance ofand are compatible with reactive gases0.80text
epitaxial growth are possible.Some disadvantages of the sputtering process are that the process is more difficult to combine with a lift-off for structuring the filminstance ofAdvanced processes0.80text
argoninstance ofThe sputter gas is typically an inert gas0.80text
oxygen or nitrogeninstance ofThe chemical reaction that the particles undergo is with a reactive gas introduced into the sputtering chamber0.80text
enabling the production of oxideinstance ofThe chemical reaction that the particles undergo is with a reactive gas introduced into the sputtering chamber0.80text

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