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Solder ball

In integrated circuit packaging, a solder ball, also known as a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps…

Underfill & Overview

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Explore the main themes, entities and connections around Solder ball. Start with the topic map, then use the sections below for research and deeper semantic analysis.

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Overview

Underfill

Advanced semantic analysis

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Map overview Semantic statistics

Solder ball

Nodes12
Edges11
Triples7
Avg. degree1.83
Density0.166667
Components1

How this topic connects Entity context

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Solder ball

Top relations

related to Underfill · 5
Solder ball → After, BGA, In, Often, PCB
is a · 1
Solder ball → solder ball subject to coining
see also · 1
Solder ball → Head-in-pillow

Important terminology Word statistics

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Important terminology

solder chip balls ball contact package flip often packages also integrated circuit printed board may underfill pcb underfilled layers packaging

Entity relationships Subject–Predicate–Object triples

SubjectPredicateObjectConfidenceSrc
Solder ballis asolder ball subject to coining0.90text
Solder ballrelated to UnderfillAfter0.60section
Solder ballrelated to UnderfillPCB0.60section
Solder ballrelated to UnderfillIn0.60section
Solder ballrelated to UnderfillBGA0.60section
Solder ballrelated to UnderfillOften0.60section
Solder ballsee alsoHead-in-pillow0.60section

Related concept clusters Concept neighborhoods

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    Connections between topic areas Semantic bridges

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    Min side: 3
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