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Multiple patterning: Directed self-assembly (DSA), Other multi-patterning techniques & Industrial adoption

Multiple patterning (or multi-patterning) is a class of technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density. It is expected to be necessary for the 10 nm and 7 nm node semiconductor processes and beyond. The premise is that a single lithographic exposure may not be enough to provide…

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Multiple patterning topic overview

The analysis highlights Directed self-assembly (DSA), Other multi-patterning techniques and Industrial adoption as prominent areas in the source structure around Multiple patterning.

Related topics
42
Source areas
10
Connected nodes
52
Extracted relationships
104
Concept neighborhoods
13
Bridge connections
52

What this topic covers Research coverage

Source areas are shown by the number of related topics found in each part of the analysis. Use smaller areas too: they can reveal specialized angles and content gaps.

Overview · 11 topics
Directed self-assembly (DSA) · 6 topics
Industrial adoption · 5 topics
Other multi-patterning techniques · 5 topics
Situations requiring multiple patterning · 4 topics
EUV multiple patterning possibilities · 3 topics
Sidewall image transfer · 3 topics
Pitch splitting · 2 topics
Spacer-is-dielectric (SID) SADP · 2 topics
Multipatterning implementations · 1 topics

Smaller areas are not necessarily less important. They contain fewer connections in this analysis and can be useful for finding specialized angles or coverage gaps.

Explore all related topics Closing gaps

Browse the complete topic structure, not only the most central items. Less prominent entities and concepts can reveal missing angles, specialized context and useful research gaps. Each item opens a new analysis centered on that subject.

Overview

Situations requiring multiple patterning

Pitch splitting

Sidewall image transfer

Spacer-is-dielectric (SID) SADP

Directed self-assembly (DSA)

Other multi-patterning techniques

EUV multiple patterning possibilities

Multipatterning implementations

Industrial adoption

Advanced semantic analysis

Deeper signals for content research, entity SEO and topical coverage. The plain-language headings explain what each technical view is useful for.

How Multiple patterning connects Entity context

The extracted context around Multiple patterning shows recurring relationship patterns in the source. For example, Multiple patterning → DUV, Especially, EUV, For, Grid, IMEC, Multiple, SADP/SAQP, Vias Another extracted example is Multiple patterning → Consequently, Current, Cut, In, LELE, Multiple, SADP, SAQP, Where. Use these groups to spot repeated connection types before inspecting the individual relationships.

Multiple patterning

Top relations

has method · 9
Multiple patterning → DUV, Especially, EUV, For, Grid, IMEC, Multiple, SADP/SAQP, Vias
related to Multiple patterning specific issues · 9
Multiple patterning → Consequently, Current, Cut, In, LELE, Multiple, SADP, SAQP, Where
related to Pitch splitting · 9
Multiple patterning → By, Consequently, For, It, LELE, Litho-Etch-Litho-Etch, The, This, When
related to DRAM · 8
Multiple patterning → Crossed, DRAM, Even, Furthermore, Like NAND Flash, Samsung, Stitched, When
related to Multipatterning implementations · 8
Multiple patterning → Current EUV, DRAM, EUV, For, Furthermore, Memory, NAND, These
related to Complementary polarity exposures · 7
Multiple patterning → IMEC, Instead, M0A, Neither, SRAM, The, This
related to EUV Multipatterning · 6
Multiple patterning → EUV, First, In, T2T, This, When
related to Leading-edge logic/ASIC multi-patterning practices · 6
Multiple patterning → EUV, Even, For, Only, Samsung, TSMC's
related to Other multi-patterning techniques · 6
Multiple patterning → EUV, LELELE, Moore's Law, Moreover, Some, There
related to Wafer productivity · 6
Multiple patterning → EUV, Multiple, Normalized WPM, Note, WPH, WPM

Important terminology

Use these terms to understand the vocabulary surrounding the topic, not as a checklist for keyword stuffing.

Important terminology

patterning euv nm pitch exposure pattern multiple may spacer line feature mask patterns also cut features single illumination two lines

Multiple patterning relationships Subject–Predicate–Object triples

TTTA extracted 104 structured relationships around Multiple patterning. Examples in this analysis include by Intel for line-cutting at its 45 nm node or TSMC at its 28 nm node → instance of → extra masks have been implemented for better patterning quality and self alignment double patterning → instance of → Since then several double patterning techniques have been developed. The table shows each extracted connection, where it came from and its confidence.

SubjectPredicateObjectConfidenceSrc
by Intel for line-cutting at its 45 nm node or TSMC at its 28 nm nodeinstance ofextra masks have been implemented for better patterning quality0.80text
self alignment double patterninginstance ofSince then several double patterning techniques have been developed0.80text
chemical shrinksinstance ofThe feature size reduction will most likely require the assistance of techniques0.80text
thermal reflowinstance ofThe feature size reduction will most likely require the assistance of techniques0.80text
or shrink assist filmsinstance ofThe feature size reduction will most likely require the assistance of techniques0.80text
Multiple patterninghas methodMultiple0.60section
Multiple patterninghas methodEUV0.60section
Multiple patterninghas methodEspecially0.60section
Multiple patterninghas methodIMEC0.60section
Multiple patterninghas methodFor0.60section
Multiple patterninghas methodSADP/SAQP0.60section
Multiple patterninghas methodDUV0.60section

Related concept clusters Concept neighborhoods

The concept neighborhoods around Multiple patterning bring nearby vocabulary together. In this analysis, examples include Patterning, Double and Exposures. Use the clusters to find adjacent concepts and terminology that may deserve separate research.

  • Multiple patterning
    • Patterning
    • Double
    • Exposures
    • Euv
    • Even
    • Use
    • Sadp
    • Exposure
    • Layer
    • Saqp
    • Mask
    • Dram
  • multiple patterning
    • Patterning
    • Double
    • Euv
    • Exposures
    • Self-aligned
    • Spacer
    • Even
    • Dram
    • Used
    • Use
    • Sadp
    • Exposure
  • euv
    • Patterning
    • Nm
    • Exposure
    • Multiple
    • Single
    • Even
    • Due
    • Node
    • Also
    • Mask
    • Would
    • Saqp
  • spacer patterning
    • Double
    • Euv
    • Self-aligned
    • Spacer
    • Dram
    • Used
    • Sadp
    • Saqp
    • Single
    • Pitch
    • Node
    • Use
  • 7 nm
    • Node
    • Patterning
    • Euv
    • Pitch
    • Double
    • Approach
    • Saqp
    • Single
    • Using
    • Even
    • Half-pitch
    • Exposure
  • 5 nm
    • Node
    • Patterning
    • Euv
    • Pitch
    • Double
    • Approach
    • Saqp
    • Single
    • Using
    • Even
    • Half-pitch
    • Exposure
  • situations requiring multiple patterning
    • Patterning
    • Double
    • Euv
    • Exposures
    • Self-aligned
    • Spacer
    • Even
    • Dram
    • Used
    • Use
    • Sadp
    • Exposure
  • euv multiple patterning possibilities
    • Patterning
    • Double
    • Euv
    • Nm
    • Exposure
    • Exposures
    • Multiple
    • Single
    • Self-aligned
    • Spacer
    • Even
    • Due

Connections between topic areas Semantic bridges

For Multiple patterning, one of the stronger structural bridges in this analysis connects Multiple patterning with Overview. Bridges highlight paths between different parts of the map and can reveal research angles that are easy to miss in a flat list.

Min side: 3
Multiple patterning — Overview · splits 41 ⟂ 12
Multiple patterning — Directed self-assembly (DSA) · splits 46 ⟂ 7
Multiple patterning — Other multi-patterning techniques · splits 47 ⟂ 6
Multiple patterning — Industrial adoption · splits 47 ⟂ 6
Multiple patterning — Situations requiring multiple patterning · splits 48 ⟂ 5
Multiple patterning — Sidewall image transfer · splits 49 ⟂ 4
Multiple patterning — EUV multiple patterning possibilities · splits 49 ⟂ 4
Multiple patterning — Pitch splitting · splits 50 ⟂ 3
Multiple patterning — Spacer-is-dielectric (SID) SADP · splits 50 ⟂ 3

Map overview Semantic statistics

Multiple patterning

Nodes53
Edges52
Triples104
Avg. degree1.96
Density0.037736
Components1

Source & methodology

TTTA analyzes the structure around Multiple patterning to surface related topics, entities, relationships, concept neighborhoods and bridge connections. Use the map to explore areas such as Directed self-assembly (DSA), Other multi-patterning techniques & Industrial adoption, including less central topics that may reveal useful research gaps. Automatically extracted connections are research leads rather than rewritten encyclopedia content.

Source: Wikipedia — Multiple patterning · EN edition · Analysis: TopicsToTalkAbout

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