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Back end of line

Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices. It is the second part of IC fabrication, after front end of line (FEOL). In BEOL, the individual devices (transistors, capacitors, resistors, etc.) are…

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Metalization

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Back end of line

Nodes21
Edges20
Triples0
Avg. degree1.9
Density0.095238
Components1

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Important terminology

metal beol layers devices process end line layer wafer ic individual fabrication vias steps interconnect silicon chapter technology back second

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