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Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
Wafer mounting, Semiconductor-die cutting & Types of blades
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wafer die process mounting preparation cut dies saw step fabrication dicing cutting performed mounted right called circuits semiconductor typically plastic
| Subject | Predicate | Object | Confidence | Src |
|---|---|---|---|---|
| Die preparation | is a | step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing | 0.90 | text |
| Die preparation | related to Wafer mounting | Wafer | 0.60 | section |
| Die preparation | related to Wafer mounting | During | 0.60 | section |
| Die preparation | related to Wafer mounting | The | 0.60 | section |
| Die preparation | related to Wafer mounting | In | 0.60 | section |
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